Reexen Technology (九天睿芯) Raises Series C+ for Compute-in-Memory AI Chips

Reexen Technology (九天睿芯) Closes Series C+ Round

Reexen Technology (九天睿芯), a Shenzhen-based AI chip company founded in 2018, has raised a Series C+ round. The funding date is October 22, 2026. The round included participation from Meituan, Rockets Capital (星航资本), Yuanhe Puhua Capital (元禾璞华), Weihao Chuangxin (韦豪创芯), OmniVision Group (豪威集团), Zhiwei Panfeng Fund (智微攀峰基金), miHoYo (米哈游), Yinghao Capital (英豪资本), and Changcun Industrial Fund (长存产业基金). The funding amount and lead investor were not disclosed.

What Reexen Technology Does

Reexen Technology develops compute-in-memory processors. Its technical approach combines SRAM compute-in-memory with high-bandwidth flash (HBF) and 3D vertical integration under a Memory-Processor-Model (MPM) co-design methodology.

The company's product line spans:

• HBF SSDs
• The ADA300 compute-in-memory chip series
• ADA400 inference cards and servers

These products cover inference workloads ranging from edge devices to cloud-scale large-model deployment.

Commercial Traction

Reexen Technology's compute-in-memory products are in mass production. The company reports device-side collaborations including vivo, Honor, and Lenovo, cloud engagements with major internet companies, and Alpha-partner status in the HBF AI chip system of a leading vendor.

Why the Round Matters

The Series C+ round brings together a broad set of strategic and financial investors across internet platforms, semiconductor-focused funds, and consumer technology companies. For an AI chip developer working at the intersection of memory and compute architecture, that investor base reflects interest in the company's MPM co-design approach and its commercial position across both edge and cloud inference.

Reexen Technology's focus on compute-in-memory addresses a central constraint in AI inference: the cost and energy of moving data between memory and processing. By combining SRAM compute-in-memory with HBF and 3D vertical integration, the company is positioning its product line to serve inference workloads at multiple scales, from devices to data-center deployments.

Acquisition Perspective

For acquirers and strategic partners, Reexen Technology offers a combination of in-house compute-in-memory architecture, a shipping product line spanning chips, SSDs, and inference cards and servers, and existing relationships across device makers and cloud operators. The Series C+ round, with participation from investors spanning internet, semiconductor, and consumer technology, signals continued backing as the company scales its mass-production compute-in-memory products.

The absence of a disclosed funding amount and lead investor means the round's size and structure are not public. The investor list, however, provides a clear view of the strategic network supporting the company.

Summary

• Company: Reexen Technology (九天睿芯)
• Headquarters: Shenzhen
• Founded: 2018
• Round: Series C+
• Funding date: October 22, 2026
• Amount: Not disclosed
• Lead investor: Not disclosed
• Investors: Meituan, Rockets Capital (星航资本), Yuanhe Puhua Capital (元禾璞华), Weihao Chuangxin (韦豪创芯), OmniVision Group (豪威集团), Zhiwei Panfeng Fund (智微攀峰基金), miHoYo (米哈游), Yinghao Capital (英豪资本), Changcun Industrial Fund (长存产业基金)
• Focus: Compute-in-memory processors, HBF SSDs, ADA300 chips, ADA400 inference cards and servers