Reexen Technology (Jiutian Ruixin) is a Shenzhen-based AI chip company founded in 2018 that develops compute-in-memory processors, combining SRAM compute-in-memory with high-bandwidth flash (HBF) and 3D vertical integration under a Memory-Processor-Model (MPM) co-design methodology. Its product line spans HBF SSDs, the ADA300 compute-in-memory chip series and ADA400 inference cards and servers, covering inference workloads from edge devices to cloud-scale large-model deployment. Its compute-in-memory products are in mass production, with device-side collaborations including vivo, Honor and Lenovo, cloud engagements with major internet companies, and Alpha-partner status in the HBF AI chip system of a leading vendor.
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Oct 22, 2026
Latest raise
Funding activity · 1 round
Oct 22, 2026
Series C+
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