AnyCasting Raises KRW 7.5 Billion Series A for TGV Glass-Substrate Plating

AnyCasting Secures Series A Funding

AnyCasting (애니캐스팅), a Korean industrial-software company, has raised a Series A round totaling KRW 7.5 billion. The round was disclosed on September 16, 2026. The investors participating in the round are Shinhan Capital, Heungkuk Securities, and Anda Asia Ventures. No lead investor was named.

What AnyCasting Does

Founded in 2001, AnyCasting develops and sells the AnyCasting casting-simulation suite and ANDA non-destructive-testing software. The company is now expanding into TGV (through-glass via) glass-substrate plating and electrochemical 3D printing for semiconductor and display applications.

According to the company, the new funding is earmarked to accelerate the TGV plating business.

Company Background

AnyCasting has been operating in the industrial-software space since 2001, building a portfolio that spans casting simulation and non-destructive testing. Its established products — the AnyCasting suite and ANDA — serve manufacturing and quality-assurance workflows. The move into TGV glass-substrate plating and electrochemical 3D printing represents an expansion beyond software into semiconductor and display process technologies.

The Investor Syndicate

The Series A round includes participation from:

• Shinhan Capital
• Heungkuk Securities
• Anda Asia Ventures

The presence of Shinhan Capital and Heungkuk Securities, both Korean financial institutions, alongside Anda Asia Ventures, suggests a mix of domestic institutional backing and Asia-focused venture capital.

Why TGV Plating Matters

Through-glass via (TGV) technology is a key enabler for glass substrates used in advanced semiconductor packaging and display applications. As chipmakers and display manufacturers push for higher performance and finer interconnects, glass substrates have drawn increasing attention as an alternative or complement to traditional organic substrates. TGV plating is a critical step in forming the conductive pathways through glass.

AnyCasting's expansion into this area leverages its existing expertise in simulation and process technology. Electrochemical 3D printing, another focus area, is relevant to advanced manufacturing where precision deposition is required.

Acquisition Angle

For acquirers in semiconductor equipment, advanced packaging, or industrial software, AnyCasting presents an interesting profile: a long-established software business with a new growth vector in TGV plating and electrochemical 3D printing. The KRW 7.5 billion Series A provides capital specifically directed at scaling the TGV plating business, which could position the company as a supplier to semiconductor and display manufacturers.

The combination of a legacy simulation and NDT software business with emerging process technology creates multiple potential integration paths. Strategic buyers in the semiconductor supply chain may see value in the TGV plating capabilities, while industrial-software acquirers may be attracted to the established AnyCasting and ANDA product lines.

What to Watch

• Progress in commercializing TGV glass-substrate plating for semiconductor and display customers
• Whether AnyCasting secures design wins or partnerships with chipmakers or display manufacturers
• How the company balances its legacy software business with new process-technology investments
• Follow-on funding or strategic partnerships involving the existing investor syndicate

As advanced packaging and glass substrates gain traction, AnyCasting's move into TGV plating places it in a specialized segment of the semiconductor supply chain that is worth monitoring for both investors and acquirers.