TeRAM is a Los Altos, California-based semiconductor startup developing custom 3D SRAM memory and packaging technology that integrates directly onto AI compute chips, serving deployments from data centers down to edge devices. Led by CEO Charlie Cheng, the founding team brings more than 80 years of combined semiconductor memory experience and has collaborated on AI compute SoC projects with leading hyperscalers. The company tailors capacity, bandwidth, form factor and packaging to the needs of each customer, targeting initial customer production in 2029.
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Sep 14, 2026
Latest raise
Funding activity · 1 round
Sep 14, 2026
$37M
Seed
Led by Primary Venture Partners
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